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The IPL6010 PlasmaNet PCB series is specifically designed for cleaning and preparing the surfaces and drill holes of printed circuit boards prior to processes such as lamination, metallisation and soldering.
Based on dry vacuum plasma surface treatment, our technology is both effective and environmentally friendly. It is designed to process 18 PCBs (24‘x18’) simultaneously.
Thanks to its unique electrode design and gas distribution, it ensures uniform treatment throughout the chamber.
Various configurations and models offer you excellent metallisation quality, regardless of the material: RT & XT Duroid®, Roger PCB, F, Polyimide, Teflon, etc.
